| Abstract |
Next generation chip technologies continue to reach smaller node sizes and narrower line-widths, driving semiconductor manufacturers to demand some of the most stringent specifications for ionic and organic contamination in ultrapure water* (UPW) systems. The International Technology Roadmap for Semiconductors (ITRS) furthermore stresses the need for environmentally friendly design and operation of factories and support systems coupled with the need to reduce use of energy, water, utilities, and chemicals. Next generation processing tools, such as immersion lithography systems, require tool manufacturers to provide total oxidizable carbon (TOC) levels of < 1 parts per billion (ppb) in UPW, forcing some tool manufacturers to supply ancillary UPW processing equipment to achieve these targets. |